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M6050

零件应在一个条件下(温度:5~35℃,湿度:45%~85%R.H.,大气压:860~1060hPa)进行测量,除非调节标准条件(温度:25±3℃,湿度为60±10%R.H.大气压:860~1060hPa)来进行测量。

1.Scope

    The specifications should be applied to electret condenser microphone of DGO6050CD(-P)

2.Storage And Judgement Conditions

             Temperature Range(°C)Rel. Humidity(%)Static Pressure(kPa)Judgement  19~21 60~70       86~106 Storage -30~70   Operating         -20~60  

3.Specifications

    Test Conditions:VS=4.5V,RL=2.2KΩ,Temp=20±2°C, R.H=60±5%

ITEMSymbolTest ConditionsMinStandardMaxUnitSensitivity  Sf=1KHz,S.P.L=1Pa-54-52-50   dB0dB=1V/PaImpedance  Zf=1KHz,S.P.L=1Pa  2.2KΩDirectivity                  Omni-directionalCurrent  Consumption  I 50 500μAOperation Voltage Range   VS 1.04.510VS/N Ratio S/N(A)f=1KHz,S.P.L=1PaA Curve55  dBDecreacing Voltage Characteristic  △Sf=1KHz,S.P.L=1PaVS=4.5-3.0V  -3dBMax.Input Sound Level MISPLf=1KHz,Distortion<3%  110dB

4.Frequency Response

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6.Test Circuit

 

   Measurement CircuitVs:Source Voltage 4.5V   RL:Load Resistance 2.2KΩ                                       

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7.Test Setup Drawing


 


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8.  Reliability Test

  

  All tests should be done after 2 hours of conditioning at 20,R.H65% ,while the sensitivity is to be within ±3dB from the initial sensitivity after the following experiments.   

 

8.1  High Temperature Test

      High temperature:                                      +80

        Duration:                                             72 hours

8.2   Low Temperature Test

      Low temperature:                                       -40

        Duration:                                             72 hours

8.3   Temperature Cycle Test (See in Fig.1)

      Low temperature:                                       -40          

        High temperature:                                       +80

        Changeover time:                                       10min

        Duration:                                               30min          

        Cycle:                                                  32

 

8.4   Statical Humidity Test

      Temperature:                                           +40 

        Relative humidity:                                       9095%

        Duration:                                               72hours      

 

 

8.5  Vibration Test

     Amplitude :                                             1.52mm

       Duration:                                               1minutes /plane

       Freq.range:                                              1055 Hz

       Total time:                                               2 hours

8.6   Dropping Test

       Drop a unit unpacked onto a board of 20mm thick.

  

        Height:                                                  1.0 m

        Cycle:                                                   6      

 

 9.   Regarding the Soldering operation

        a.  Use 25~ 30W soldering iron and maintain 310~330 in operation.

        b.  Operators who work in the solder fixture and the soldering iron must be statically grounded                    

            under each soldering process.

        C.  Soldering should be accomplished within two seconds at each terminal so as not to be overheated.

        d .  Optimal design for heat sink pad is same as below.

       

 

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NO.

Part name

Material Type

Qty

Origin

Manufacture

Remarks

1

PCB

FR-4

1




2

FET

K596

1




3

Holder

POM

1




4

Back plate

Cu

1




5

Spacer

Mylar

1




6

Film

FEP

1




7

Outer most shell

AL

1




8

Cloth

Fabrics

1




 

10Assembly process

   a)After connector and holder are once disassembled , they should not be re-used.

   b)Do not touch outer springs directly(except for PCB or proper terminal set at nominal height.

   c)Do not give any mechanical shocks to the micphone(e.g. dropping to floor)

 

11General information

  11-1: This microphone shall not be operated or stored in following environment.

     >where liquid(water,solvent and so on)splashes.

     >where the air has a high concentration of corrosive gas .

     >where is too dusty.

     >where temperature changes rapidly.

 

  11-2: Frequency response especially in high frequency region is dependent on the structure of enclosure.

 

   Please remove additional acoustic mass or cavity in front of the microphone to the utmost.

 

  12-3:do not put mechanical pressure more than 2 kg to the microphone.

 

  13-4: microphone should not be in state of outgoing packing for a long-term storage.

 

  14-5: all the soldering procedures upon microphone must be complete in a metallic device,the temperature of the soldering irons must be limited as 320 and less 3 s ,the operatorsthe solder fixtures and the soldering irons must be statically grounded under each soldering process.


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